ThermoShuttle Corp. ( TSC, 元瑞科技) is formerly founded in March, 2003. Its founders and key members have accumulated more than 20 years' experience and IPs in designing and manufacturing advanced thermal solutions, including vacuum soldered heat sinks, vacuum brazed heat sinks, reflow soldered heat sinks, and vapor chamber.

TSC positions itself as an OEM/ODM thermal solution maker, serving worldwide cooler companies and IT companies. The following solutions are our recent focus:
1. Intel P4 heat sink families :
2. AMD K7 heat sink series : 2200+, 2400+, 2600+, 2800+, 3200+
3. AMD K8 heat sink series : Athlon 64
4. Thermal modules: integrated with heat pipes , vapor chamber, and other high-K components for server, mini PC, IPC, and NB applications.
5. High-K interface materials: TMG 301.
6. Thermal Modules for consumer electronics.

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THERMOSHUTTLE CO., LTD                                                                                                        HEAD OFFICE :7F,No.8, Lane 122, Sec.2, Gan Yuan St., Shulin City, Taipei Hsien Taiwan, R.O.C
TEL:+886-2-2680-3788  EXT.666  FAX:+886-2-2680-3887
　

FACTORY:Golden Bridage Industrial Estate, Ching Shi Zhen, Dong Guan City, Guang Dong     Province, PRC                                                                                                                            TEL:+886-2-2680-3788  EXT.666  FAX:+886-2-2680-3887

E-mail: sales@thermoshuttle.com